Thin-film circuit ceramic packaging substrates are widely used in 5G optoelectronic devices such as LED lighting, UV LED, car lights, flashlights, face recognition, and Lidar due to their high reliability, high thermal conductivity, high circuit resolution, high circuit flatness.
Features: This substrate features high flatness, good heat dissipation, good corrosion resistance, good ink adhesion, small size, high level of integration.
Model:
3565Material:
Aluminum nitrideSubstrate Thickness:
0.43±0.05 mmNumber Of Typeset:
189 pcs/sheetSheet Size:
109.2×54.5 mmSingle Size:
3.5×6.5 mmMinimum Line Width:
0.23 mmGap Size:
0.13 mmMinimum Aperture:
0.06 mmCopper Thickness:
40±15 μmDam Thickness：
Step Height：
Boss Copper Thickness：
Metal Column High:
