Thin-film circuit ceramic packaging substrates are widely used in 5G optoelectronic devices such as LED lighting, UV LED, car lights, flashlights, face recognition, and Lidar due to their high reliability, high thermal conductivity, high circuit resolution, high circuit flatness.
Features: This substrate features high line precision, high thermal conductivity, high flatness, suitable for four-color chip packaging.
Model:
5050Material:
Alumina/aluminum nitrideSubstrate Thickness:
0.60±0.05 mmNumber Of Typeset:
180 pcs/sheetSheet Size:
109.2×54.5 mmSingle Size:
5.0×5.0 mmMinimum Line Width:
0.15 mmGap Size:
0.08 mmMinimum Aperture:
0.08 mmCopper Thickness:
50±15 μmDam Thickness：
Step Height：
Boss Copper Thickness：
Metal Column High:
