Thin-film circuit ceramic packaging substrates are widely used in 5G RF front-end discrete devices and module packaging due to their high reliability, high thermal conductivity, high circuit resolution, high circuit flatness, and excellent noise reduction and anti-interference capabilities.
Features: This substrate has a high degree of integration, high reliability, and low cost. It is also miniaturized, allowing it to realize the stacked package of microwave multi-chip modules with different functions in the Z-axis direction.
Model:
9550Material:
Alumina/aluminum nitrideSubstrate Thickness:
0.6±0.05 mmNumber Of Typeset:
90 pcs/sheetSheet Size:
109.2×54.5 mmSingle Size:
9.45×4.76 mmMinimum Line Width:
0.15 mmGap Size:
0.10 mmMinimum Aperture:
0.07 mmCopper Thickness:
50±15 μmDam Thickness：
Step Height：
Boss Copper Thickness：
Metal Column High:
